Based on Lam’s industry-leading silicon etch systems, the TCP® 9400DSiE™ product family is being utilized by major customers worldwide for a wide range of MEMS, TSV, power device, and passive component deep silicon etch applications. The products have the flexibility to use both Bosch and steady-state processes to meet the challenges of silicon deep reactive ion etch. Pulsed low-frequency plasma technology enables stop-on-oxide etch with minimal notching. System features such as in-situ automated chamber cleaning and precise control of RF delivery provide superior process stability for high yield on demanding device requirements.