nDetail Job Description:
àPerforms a wide variety of electronic, electro-mechanical, mechanical or measurement product assembly operations on product components, assemblies or sub-assemblies.
執行多種產品包含電子、電機、機械、測量產品之成品及模組組裝
àFollows assembly procedures and sequence of operations in performing wiring, component installation, cable harnessing.
組裝時都能遵照組裝規範及操作程序來執行
àAble to communicate with manufacturing engineer on issues discovered during system level assembly.
組裝時如發現任何問題,都能夠與製造工程師進行溝通協調
nEducation:
àTwo-year College degree or above in engineering or related field.
2年或以上工程領域相關的同等學歷
nSkill:
àBasic English and computer skills.
基礎英文及電腦技能
àBasic knowledge in semiconductor Etch/Deposition equipment configuration is a plus.
對半導體蝕刻或沉積設備機構有基本知識尤佳
àPositive and self-disciplined working attitude.
積極及自律的工作態度
àRotating shifts required
需要輪班